The Experimental Astrophysics Group (EAG) at the Space Sciences Lab is one of the premier groups working on detectors and microchannel plates. I began at the Space Sciences Lab originally as a lab assistant, supporting various lab operations in the EAG. Over the year (and counting) at the lab, I have worked on a variety of experimental detector hardware, designed laboratory test equipment, and integrated flight hardware. Through this portfolio, I will provide an in-depth overview of projects, as well as skills utilized throughout the engineering process.

Many thanks to Dr. Oswald Siegmund and staff researcher Travis Curtis at the Space Sciences Lab for mentoring me throughout my work in the Experimental Astrophysics group.

50MM XS Interposer

One of the greatest challenges of detector manufacturing is testing hardware without irreversibly damaging possible flight hardware. Especially in the case of these square cross-strip detectors, manufacturing replacement detectors would not only cost a fortune but also take significant time to seal the detector tubes. On the back of these detectors is an array of pads outputting the signal of each anode "strip" in the X and Y directions. In order to avoid soldering a connector and risk damaging the detector in the solder/desoldering process, an interposer, which contacts the pads via small pins, can be used to provide a temporary connection to test hardware. I designed the interface PCB as well as the hardware required to interface the detector to existing vacuum equipment. A variety of space constraints and PCB routing was considered throughout the design process of the interposer. This hardware was manufactured, however, awaits completion of the first 50MM detectors for testing (likely Winter 2023).

Skills Applied: Solidworks, Altium

50MM XS Detector Tooling Design

A primary objective of the Experimental Astrophysics Group is to demonstrate the manufacturability of detectors of various imaging resolutions. One of the most difficult challenges I faced was to design tooling to allow for a glass window to be sealed on the detector face using melted indium. Most detectors are only operational under vacuum and therefore must be sealed while in a thermal vacuum chamber. The tooling would also undergo high thermal stress, as the indium must be melted while the detector is the chamber for sealing. 

The hardware I designed allows for controlled mounting of the detector body, locating of the window to the detector body, as well as fixturing to allow transport of the delicate glass window for sealing. Parts were machined out of 304L Stainless Steel and Ceramic (nonconductive). Hardware was also designed to allow for testing of the detector while in the TVAC chamber.

Additional hardware was also designed for metal deposition on the glass window of the detector to allow for proper sealing.

Skills Applied: Solidworks, Design for High Vacuum, Design for Thermal Deformation

100MM XS Detector Tooling Design

Similar to the 50mm detector, similar tooling must be designed for the 100mm variant of the detector. As a result of the size increases, there are numerous volume and size constraints that make the design much more challenging.  Due to the constraint of the thermal vacuum chamber itself, the tooling design is significantly modified from the 50mm design

This project is currently still in progress, and parts have not been manufactured yet. Additional hardware for testing the 100mm variant of the detector is still in progress, including hardware to power and read data off the detector.

Skills Applied: Solidworks, Design for High Vacuum, Design for Thermal Deformation

Analog Signal Delay

One variant of a detector (XDL, or cross delay line detector) technology utilizes the time it takes for an electron to reach either end of a length of wire. Based on the timing, difference, we can calculate the relative position of the detector face. However, this needs to be calibrated in the testing configuration in order to offset the signal delay to correctly position the image on the detector. To provide this easily selectable analog signal delay for XDL detector, I along with my co-engineer Andrew Ji worked to design a signal delay that fits inside the NIM standard. One of the major design considerations is minimizing noise and signal loss through the analog delay. Early on, we dealt with signal reflections due to hanging wires. This was resolved in later revisions of the PCB. I predominantly focused on designing the PCB and the front panel of the Delay.

Skills Applied: Solidworks,  Adobe Illustrator, Altium, Circuit and Signal Analysis

Miscellaneous Projects

Over the course of the year (and counting) at the lab, there were numerous smaller miscellaneous projects that required design work. A few of them are included here. Included is a high-voltage adaptor from Renyolds Centroid connector to SHV designed to work in a vacuum chamber.

Skills Applied: Solidworks,  Altium, Cleanroom Operations